Book: Chemical-mechanical Planarization Of Semiconductor Materials This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Details of Book: Chemical-mechanical Planarization Of Semiconductor Materials Book: Chemical-mechanical Planarization Of Semiconductor Materials
Author: Michael R. Oliver
ISBN: 3540431810
ISBN-13: 9783540431817
, 978-3540431817
Binding: Hardcover
Publishing Date: 26012004
Publisher: Springer
Number of Pages: 444
Language: English