Electroplating And Electroless Plating Of Copper And Its Alloys (book And Cd Rom Database)

Contents :

Chapter 1 Introducing Copper
1.1 PROPERTIES
1.1.1 Chemical Properties
1.1.2 Toxicity of Copper
1.1.3 Physical Properties
1.1.4 Mechanical Properties
Chapter 2 Electrodeposition of Copper and its Alloys
2.1 PRINCIPLES
2.2 PROCESSES
2.2.1 Alkaline Cyanide Electrolytes
2.2.2 Acid Sulphate Copper Plating Baths
2.2.3 Other Copper Plating Baths
2.3 THE DEPOSITION OF COPPER ALOOYS
2.3.1 Brass plating
2.3.2 Bronze Plating
2.3.3 Other Alloy Plating Solutions
2.4 ALKALINE COPPER PLATING BATHS
Chapter 3 The TEchnology of Electrodeposition of Copper and Copper Alloys
3.1 INTRODUCTION
3.2 CYANIDE PLATING BATHS
3.3 ACID SULPHATE COPPER PLATING BATHS
3.4 OTHER COPPER PLATING BATHS
3.5 BARREL COPPER PLATING
3.6 RACK PLATING
3.7 CONTINUOUS COPPER PLATING
3.8 COPPER-ZINC ALLOY (BRASS) PLATING
3.9 COPPER-TIN ALLOY (BRONZE) PLATING
3.10 COPPER PLATING SOLUTIONS for SURFACE PRE-treatment
3.11 ELECTROFORMING
Chapter 4 The Properties of Copper and Copper Alloy Coatings
4.1 COPPER COATINGS
4.2 COPPER ALLOY COATING
4.2.1 Brass (Copper-Zinc)
4.2.2 Bronze (copper-tin)
Chapter 5 The Application of Electrodeposited Coppper and Copper Alloy Coatings
5.1 INTRODUCTION
5.2 DECORATIVE APPLICATIONS
5.3 FUNCTIONAL APPLICATIONS
5.4 COLOURING OF COPPER AND COPPER ALLOY COATINGS
5.4.1 Surface PPrepration Before Colouring
5.4.2 Colouring Solutions
5.4.3 General Guidelines on Colouring
5.5 BLACK COLOURING (BLACK OXIDE) IN THE PRINTED CIRCUIT BOARD INDUSTRY
5.6 ELECTRICAL AND ELECTRONICS INDUSTRIES
Chapter 6 Electrolessly Deposited Copper Coatings
6.1 HISTORICAL REVIEW
6.2 PROCESSES
6.3 ELECTROLESS COPPER PLATING BY CHEMICAL REDUCTION
6.4 PRE-TREATMENT
6.5 APPLICATIONS
6.6 COPPER PLATING BATHS FOR PRINTED CIRCUIT BOARD MANUFACTURE
6.7 OUTLOOK
Chapter 7 Properties of Electroless Copper Coatings
7.1 INTRODUCTION
7.2 COPPER COATINGS
7.2.1 Copper Electrolytes
7.3 SURFACE MORPHOLOGY
7.3.1 Scanning Electron Microscopy
7.4 SURFACE ROUGHNESS
7.4.1 Profilometer
7.5 DEGREE OF PURITTY
7.5.1 ESCA Investigations
7.5.2 Auger electron Spectroscopy
7.5.3 Energy-Dispersive X-Ray Analysis
7.5.4 Electron-beam Microanalysis
7.6 MICROSTRUCTURES
7.6.1 Optical Microscopy
7.6.2 Transmission-Electron Microscopy
7.6.3 Electron Diffraction Experiments
7.7 INTERNAL STRESS
7.7.1 X-Ray Fine-Structure Investigation
7.8 DUCTILITY
7.8.1 Hydraulic Bulge Test
7.8.2 Tensile Test
7.9 TENSILE STRENGTH
7.9.1 Tensile Test
7.10 HARDNESS 180
7.10.1 Vickers Microhardness
7.11 ELECTRICAL RESISTANCE
7.11.1 Four-Probe Current-potential Method
Chapter 8 Quality Assurance,Analysis and Process Optimization in Copper Deposition
8.1 INTRODUCTION
8.2 MONITORING AND ANALYSIS OF SOLUTIONS
8.2.1 Analytical Control of the Metal Content
8.2.2 Control of Additive Concentrations
8.2.3 Indirect Electrochemical Methods
8.2.4 Optical Methods
8.3 PROCESS OPTIMIZATION
8.3.1 Factors Influencing the Process
8.3.2 Throwing Power and Current Distribution
8.3.3 Taguchi Statistical Experiments Design
Chapter 9 Stripping of Copper and Copper Alloy Coatings
9.1 GENERAL
9.2 COPPER STRIPPING PROCESSES
9.2.1 Mechanical Processes
9.2.2 Wet-Chemical Processes
9.3 SURFACE PREPARATION BEFORE FURTHER ELECTROPLATING
9.4 WASTE DISPOSAL METHODS FOR COPPER STRIPPING SOLUTIONS
Chapter 10 Recycling And Effluent Treatment
10.1 THE PROBLEM
10.2 PROCESSES IN RECYCLING TECHNOLOGY
10.2.1 Reduction in Water Volume
10.2.2 The Technology of Ion Exchange
10.2.3 Retardation Processes
10.2.4 Membrane Filtration
10.2.5 Electrolytic Processes
10.2.6 Evaporation and Vaporiozation
10.3 EFFLUENT TREATMENT
10.3.1 The Main Process
10.3.2 Dewatering Processes
10.3.3 After-treatment Processes
Chapter 11 Copper In Microtechnology
11.1 Introduction
11.2 Electrodeposition of Metallic Microstructures
11.3 Electrolytes and Plant Technology
11.3.1 Acid copper Electrolytes
11.3.2 The Copper Tetrafluoroborate Electrolyte
11.3.3 Methane Sulphonate Electrolytes
11.3.4 Cyanide and Pyrophosphate Electrolytes
11.4 Plant Technology
11.5 The Influence of the Basis Material
11.6 Applications
11.6.1 Micro-relays
11.6.2 Sacrifical Layer Technique for Movable Microstructures
11.6.3 Electrodes for Micro Spark Erosion
11.6.4 Mould Inserts with Copper Backfilling
11.7 Outlook
Chapter 12 Copper In Printed Circuit Board Technology
12.1 Introduction
12.2 Printed Circuit Board Construction
12.2.1 Resin Systems for Printed Circuit Boards
12.2.2 Electrochemical Production of Copper Foils
12.3 Possible Methods of Constructing of Printed Circuit Boards Subtractive, Semi-Additive, and Fully-Additive Processes
12.3.1 Subtractive Processes
12.3.2 Additive Processes
12.4 Electrodeposition of Planner High-Ductility Copper Coatings
12.4.1 Organic Additives and their Mechanism in Copper Electroytes
12.4.2 Reverse-pulse Plating
12.4.3 Plant Technology
12.5 Chemical Copper Plating
12.6 Printed Circuit Boards with Micro-Holes-High Density Interconnection (HDI)
12.7 Outlook
Appendix
Index