3 PCS 0.3ml Thermal Grease Paste Heat Sink Compound for CPU & Chipsets Carbon Based Thermal Paste (0.3 ml 1.93 W/mK)
Type
Carbon Based
Quantity
0.3 ml
Viscosity
200 Pa-s
Thermal Conductivity
1.93 W/mK
Composition
Aluminium Oxide, Zinc Oxide
Net Quantity
0.3 ml
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Low thermal resistance and high thermal conductivity. Apply to CPU, VGA, LED Chipset and other PC Components Compliance with RoHS REACH PFOS requirements.