DIAMOND Diamond Silicon Heat Sink Compound 250gm Set of 3 Metal Based Thermal Paste (250 g 3 W/mK)
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Highlights
thermal paste
Description
This is a syringe of heatsink compound (aka thermal grease, thermal paste, thermal goo). Use this whenever you’re connecting a component to a heatsink, it’ll really help to dissipate even more potentially damaging heat.
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Specifications
In The Box
1
General
Brand
DIAMOND
Model Number
DE-0003
Model Name
Diamond Silicon Heat Sink Compound 250gm Set of 3
Type
Metal Based
Quantity
250 g
Viscosity
1 Pa-s
Thermal Conductivity
3 W/mK
Composition
Aluminium Oxide, Zinc Oxide
Net Quantity
250 g
Dimensions
Width
12 inch
Height
12 inch
Depth
10 inch
Additonal Features
Key Features
This HY500 series thermal grease offer better cooling performance with high thermal conductivity graphite and powder., This thermal grease should be used to fill the gaps and expanding cooling area between the component and the heat sink., With a wide range working temperature, keep stable performance at temperature -30~300 High performance, Low Thermal Impedance Keep grease condition with long time
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