Hutixi Hutixi Thermal Grease Paste, CPU Paste, Heat Sink Compound for CPU and Chipset 10 Grams (Pack of 4) Carbon Based Thermal Paste

Hutixi Hutixi Thermal Grease Paste, CPU Paste, Heat Sink Compound for CPU and Chipset 10 Grams (Pack of 4) Carbon Based Thermal Paste  (10 g 1.2 W/mK)

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Description
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.
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Specifications
In The Box
  • 4 Thermal Grease
General
Brand
  • Hutixi
Model Number
  • HT-GY260 Pack of 4
Model Name
  • Hutixi Thermal Grease Paste, CPU Paste, Heat Sink Compound for CPU and Chipset 10 Grams (Pack of 4)
Type
  • Carbon Based
Quantity
  • 10 g
Viscosity
  • 200 Pa-s
Thermal Conductivity
  • 1.2 W/mK
Composition
  • Aluminum Oxide, Zinc Oxide
Suitable For
  • Processor, Chipset
Net Quantity
  • 10 g
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