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Integrated Passive Component Technology (English, Hardcover, unknown)

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Author

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Highlights

Language: English
Binding: Hardcover
Publisher: John Wiley & Sons Inc
Genre: Technology & Engineering
ISBN: 9780471244318, 0471244317
Edition: 2003
Pages: 379

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Description

This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology. Describes the processes available for creating integrated passives, measuring their properties, and applying them. Brings reader up to date in a fast-moving technology. Enables reader to implement the technology into a manufacturing environment. Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI. Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.

Specifications

Book Details

Imprint	Wiley-IEEE Press
Publication Year	2003

Contributors

Author Info

RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society’s Dielectric Science and Technology Division.
LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.

Dimensions

Width	24 mm
Height	245 mm
Length	162 mm
Weight	683 gr

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