(Pack of 5) 0.3ml Each - Thermal Grease Paste - Low Thermal Resistance
Model Name
(Pack of 10) Thermal Grease Paste - Low Thermal Resistance
Type
Carbon Based
Quantity
0.3 ml
Viscosity
150 Pa-s
Thermal Conductivity
1.93 W/mK
Composition
Metallic Oxide in Silicone Base
Thermal Resistance
0.225 Km2/W
Suitable For
CPU, VGA, LED and other CPU components
Minimum Temperature Limit
-50
Maximum Temperature Limit
210 degree C
Paste Color
Grey
Net Quantity
0.3 ml
Dimensions
Width
5 inch
Height
0.2 inch
Depth
0.2 inch
Additonal Features
Other Features
Compliance with RoHS REACH PFOS requirements
Key Features
High Thermal Conductivity (>1.93W/m-k), Low Thermal Resistance (<0.225C-in2/W), Electrically Non-Conductive, Apply to CPU, VGA, LED and other CPU components, Pack of 10 Syringe, 0.3ml per syringe
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Heat Sink Compound is a non-curing, water resistant paste heavily filled with heat conductive metallic oxides in a Silicone base. It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component/ device. Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers. Also used as a non-flammable coating for fly back transformer connections in TV chassis and similar applications. Features: High Thermal Conductivity Low Thermal Resistance Electrically Non-Conductive Non-Curing Non-Capacities Non-Corrosive Bleed resistant Temp resistant from -50 to 210 deg C.