UB Next 5 Grams Thermal Grease Paste Compound For CPU & Chipset (Injection Packing) Carbon Based Thermal Paste  (5 g 1.93 W/mK)

UB Next Grey Thermal Grease is ISOL 6, Heat Sink Compound is a non-curing, water-resistant paste heavily filled with heat conductive metallic oxides in a Silicone base. It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical/electronic component/device to the heat sink or chassis, thereby increasing the overall efficiency of the component/device. Generally used as a thermal coupling of electrical/electronic devices to heat sinks such as base or mounting studs of transistors, diodes, and rectifiers. Also used as a non-flammable coating for flyback transformer connections in TV chassis and similar applications. Features: High Thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant from -50 to 210 C