AKT AMAOE EMMC-3 STENCIL For EMMC/EMMCP/UFS/UMCP/LPDDR/NAND/PCI BGA162,BGA153, BGA169, BGA221, BGA186, BGA297,BGA254, BGA178, BGA200,BGA110 BGA110, BGA60,BGA70, BGA60,BGA70,LPDDR/NAND/PCI Stencil  (Pack of 1, 2D)

Stencil Purpose: The EMMC-3 Stencil is used to precisely apply solder paste or solder balls to specific areas on a PCB where components like eMMC, eMCP, UFS, UMCP, LPDDR, NAND, or PCI devices will be mounted. Alignment: Stencils are designed with precise cutouts or openings that match the footprint of the component or components being soldered. This ensures accurate placement and soldering during the assembly or rework process. Soldering Process: During the PCB assembly or rework process, the stencil is aligned with the PCB, and solder paste or solder balls are applied through the stencil's openings onto the PCB's solder pads. Heating: After applying the solder paste or solder balls, the PCB is typically heated to melt the solder and create a secure electrical connection between the component and the PCB. Component Compatibility: The specific stencil you mentioned, the EMMC-3 Stencil, is designed for use with components like eMMC, eMCP, UFS, UMCP, LPDDR, NAND, and PCI devices. These components often have fine-pitch solder pads that require precise soldering.