AKT AMAOE IP 8G/8P/X (A11) STENCIL BGA IP 8G,IP 8 PLUS,IP X ,A9 CPU Reballing for tin tin mesh Wrap around microchip BGA Heating MSM8956 CPU Redmi, STEEL Stencil
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AKT AMAOE IP 8G/8P/X (A11) STENCIL BGA IP 8G,IP 8 PLUS,IP X ,A9 CPU Reballing for tin tin mesh Wrap around microchip BGA Heating MSM8956 CPU Redmi, STEEL Stencil (Pack of 1, SQUARE)

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AKT AMAOE IP 8G/8P/X (A11) STENCIL BGA IP 8G,IP 8 PLUS,IP X ,A9 CPU Reballing for tin tin mesh Wrap around microchip BGA Heating MSM8956 CPU Redmi, STEEL Stencil  (Pack of 1, SQUARE)

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₹380
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  • Delivery
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      Delivery by4 May, Sunday|Free
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      if ordered before 2:59 AM
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    Highlights
    • For tin mesh Wrap around microchip BGA Heating MSM8956 CPU Redmi, STEEL
    • SQUARE Pattern
    • STAINLESS STEEL Material
    • W x H: 8 x 10 cm
    • Color: GREAY
    Services
    • Cash on Delivery available
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    Seller
    AKinfoTools
    3.3
    • 7 Days Return Policy
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  • Description
    AMAOE IP 8G/8P/X (A11) STENCIL
    Read More
    Specifications
    In The Box
    Sales Package
    • 1
    Number of Contents in Sales Package
    • Pack of 1
    General
    Pattern
    • SQUARE
    Material
    • STAINLESS STEEL
    Suitable For
    • POSSIBLE VALUES, AMAOE IP 8G/8P/X (A11) STENCIL
    Style
    • SQUARE SHEET
    Re-usable
    • Yes
    Net Quantity
    • 1
    Dimensions
    Width
    • 8 cm
    Height
    • 10 cm
    Frequently Bought Together
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