AKT AMAOE MI-11 BGA Reballing Stencil For Xiaomi Max RedMI NOTE 2 3 MSM8965 MT6795 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh SDR660,PMI632,PM6125,BGA254,PM670,PM670L,WCD9370,MT6330P,SM6125 Stencil

AKT AMAOE MI-11 BGA Reballing Stencil For Xiaomi Max RedMI NOTE 2 3 MSM8965 MT6795 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh SDR660,PMI632,PM6125,BGA254,PM670,PM670L,WCD9370,MT6330P,SM6125 Stencil (Pack of 1, SQUARE)

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AKT AMAOE MI-11 BGA Reballing Stencil For Xiaomi Max RedMI NOTE 2 3 MSM8965 MT6795 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh SDR660,PMI632,PM6125,BGA254,PM670,PM670L,WCD9370,MT6330P,SM6125 Stencil  (Pack of 1, SQUARE)

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6 Ratings & 0 Reviews
₹383
850
54% off
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  • Delivery
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      Delivery by16 Aug, Saturday
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    Highlights
    • For SDR660,PMI632,PM6125,BGA254,PM670,PM670L,WCD9370,MT6330P,SM6125
    • SQUARE Pattern
    • STAINLESS STEEL Material
    • W x H: 8 x 10 cm
    • Color: GREAY
    Services
    • Cash on Delivery available
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    Seller
    AKinfoTools
    3.8
    • 7 Days Return Policy
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  • Description
    SDR660,PMI632,PM6125,BGA254,PM670,PM670l,WCD9370,MT6330P,SM6125,SDM710 CPU ,MT6785V,WCN3950,MT6359VKP,MT6186MV
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    Specifications
    In The Box
    Sales Package
    • 1
    Number of Contents in Sales Package
    • Pack of 1
    General
    Brand
    • AKT
    Model Number
    • 2 3 MSM8965 MT6795 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh
    Type
    • SDR660,PMI632,PM6125,BGA254,PM670,PM670L,WCD9370,MT6330P,SM6125
    Color
    • GREAY
    Pattern
    • SQUARE
    Material
    • STAINLESS STEEL
    Suitable For
    • It’s used for reballing and soldering SMDs and BGA components, especially in mobile and electronics repair.
    Style
    • SQUARE SHEET
    Re-usable
    • Yes
    Net Quantity
    • 1
    Model Name
    • AMAOE MI-11 BGA Reballing Stencil For Xiaomi Max RedMI NOTE
    Dimensions
    Width
    • 8 cm
    Height
    • 10 cm
    Frequently Bought Together
    Ratings & Reviews
    4
    6 Ratings &
    0 Reviews
    • 5
    • 4
    • 3
    • 2
    • 1
    • 3
    • 2
    • 0
    • 0
    • 1
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    Questions and Answers
    Q:What is the stencil's size?
    A:The size is compact, fitting the needs of intricate IC repairs.
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    Q:Does it include accessories?
    A:The stencil is generally sold separately without accessories.
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    Q:How do I clean the stencil?
    A:Use alcohol or flux cleaner for optimal maintenance.
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    Q:Is it beginner-friendly?
    A:Suitable for trained users but can be used by beginners with guidance.
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    Q:Does it support BGA rework?
    A:Yes, its ideal for BGA rework and reballing tasks.
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    Q:What thickness is the stencil?
    A:The thickness is typically 0.12mm.
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    Q:Can it be reused?
    A:Yes, its reusable after cleaning.
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    Q:What is the material of the MI-11 Stencil?
    A:Its made of durable stainless steel.
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    Q:Is the MI-11 Stencil compatible with specific phones?
    A:Yes, designed for certain mobile models; check compatibility before use.
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    Q:What is the AMAOE MI-11 Stencil used for?
    A:It used for IC chip reballing and repair on mobile devices.
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