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    AKT MECHANIC XG-30 Solder Flux Paste Tin Paste Flux for PCB SMD BGA Repair Tools Adhesive
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    AKT MECHANIC XG-30 Solder Flux Paste Tin Paste Flux for PCB SMD BGA Repair Tools Adhesive (16 g)

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    AKT MECHANIC XG-30 Solder Flux Paste Tin Paste Flux for PCB SMD BGA Repair Tools Adhesive  (16 g)

    3.5
    23 Ratings & 1 Reviews
    Special price
    ₹212
    ₹400
    47% off
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    • Warranty
    NA
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      Delivery by17 Sep, Wednesday
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    Highlights
    • NA
    Services
    • NA
    • Cash on Delivery available
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    Seller
    AKinfoTools
    3.7
    • No Returns Allowed
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    • Description
    MECHANIC XG-30 16G 183° PPD PASTE SOLDER PASTE ROOM TEMPERATURE MELTING POINT 183 FLUX EASY WELDING STRONG MEDIUM TEMPERATURE SOLDER PASTE. Description: 1. New technical support and unique chemical formula provide excellent wetting, to ensure high reliability. 2. Adapted to the mobile phone repair industry, computer digital service industries and high-precision circuit board soldering SMT/BGA soldering processes. 3. The viscosity is moderate, there is almost no patch collapse, and the components do not shift. 4. Good wettability & Good weldability High-end quality, a unique formula, perfect performance. 5. Suitable for a variety of welding environments, and a wide range of applications, with high compatibility. 6. The storage time is up to 12 months in a refrigerated environment. Unique high-quality solder tin paste(the best configuration ingredients: Sn42/Bi58) makes the adhesion long-lasting, it is not easy to dry, and the viscosity time is up to 48 hours. 7. The residue is colorless and transparent, does not affect the detection, is disposable, and has excellent cleaning performance. 8. Use of efficient energy thixotropic agents, printing and preheating collapse, and special solder ensure a good printing and fine pattern. 9. Uncompromising performance in an ultra-light ultra body, heavyweight performance without the weight. Fine and flexible packaging, delicate appearance.
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    Specifications
    In The Box
    pack_of
    • 1
    Sales Package
    • 1
    General
    Brand
    • AKT
    Model Name
    • MECHANIC XG-30 Solder Flux Paste Tin Paste Flux for PCB SMD BGA Repair Tools
    Quantity
    • 16 g
    Composition
    • Rosin: A natural resin that acts as a fluxing agent, helping to clean the surfaces being soldered and improving solder flow., Active Agents: These are specific chemicals that enhance the flux's ability to remove oxidation and promote soldering. They can vary but often include amines or organic acids., Solvents: Typically, a small amount of solvent may be included to help maintain the paste's consistency and facilitate application. Common solvents include isopropyl alcohol or other organic solvents., Additives: Other additives may be included to improve the performance characteristics, such as viscosity control agents or stabilizers to prolong shelf life., Inert Fillers: Sometimes used to adjust the physical properties of the paste, ensuring it maintains the desired consistency and application characteristics.
    Suitable For
    • POSSIBLE VALUES, Mobile Touch Screen, • High Quality Silicones, mobile pcb cleaning, Telephone cleaning, MOBILE PHONE IC
    Adhesive Type
    • Paste
    Used For
    • Soldering and desoldering electronic components on PCBs (Printed Circuit Boards), Rework and repair of circuit boards, especially in mobile and laptop repairs, Improving solder flow by cleaning and preparing the surface for better solder adhesion, Preventing oxidation during the soldering process, ensuring stronger connections
    Permanent
    • No
    Applicator Type
    • PASTE
    Dyed
    • No
    Usage Instructions
    • Note: Always ensure good ventilation when soldering, and avoid direct contact with the flux paste. Use appropriate safety gear like gloves and protective eyewear if needed.
    Shelf Life
    • 12 Month
    Specific Gravity
    • 0
    Wet Color
    • light yellow, amber
    Dry Color
    • Yes
    Bond Time
    • 1 min
    Dry Time
    • 2 min
    Viscosity
    • thick
    Temperature Range
    • 180, 250
    Adhesive Strength
    • High
    Certification
    • RoHS Compliant: Indicates that the product does not contain hazardous substances above specified limits, making it safer for the environment and suitable for electronic applications., REACH Compliant: Ensures that the product meets the European Union regulations regarding the safe use of chemicals., MSDS (Material Safety Data Sheet): Provides information on the properties, hazards, and handling of the flux paste.
    Net Quantity
    • 16 g
    Additional Features
    Weatherproof
    • No
    Water Resistant
    • No
    Acid Free
    • Yes
    UVA Resistant
    • No
    Nonflammable
    • No
    Technology Used
    • No-Clean Flux Technology: This formulation allows the flux to leave minimal residue after soldering, eliminating the need for post-soldering cleaning processes., Rosin-Based Composition: The use of natural rosin in the flux helps improve solderability and provides good wetting properties, enhancing the quality of the solder joints., High Activity Level: The flux is designed to be highly effective in cleaning oxides and contaminants from the surfaces being soldered, ensuring strong adhesion and better solder flow., Thermal Stability: The flux paste is formulated to withstand high temperatures during soldering, maintaining its performance and properties throughout the soldering process., Compatibility: The technology allows for use with both leaded and lead-free soldering, making it versatile for various applications in electronics.
    Other Features
    • Ease of Use: The paste consistency allows for easy application, making it suitable for both beginners and experienced technicians., High Viscosity: The thick texture helps keep the paste in place during application, preventing it from running or dripping, which is essential for precision work., Excellent Performance in Fine Work: Ideal for delicate soldering tasks, such as mobile device repairs, where precision is crucial., Environmentally Friendly: Typically free from hazardous substances, aligning with modern environmental standards like RoHS compliance.
    Dimensions
    Width
    • 19 cm
    Height
    • 12 cm
    Depth
    • 5 cm
    Weight
    • 0.1 g
    Other Dimensions
    • NA
    Warranty
    Warranty Summary
    • NA
    Service Type
    • NA
    Covered in Warranty
    • NA
    Not Covered in Warranty
    • NA
    Frequently Bought Together
    AKT MECHANIC XG-30 Solder Flux Paste Tin Paste Flux for PCB SMD BGA Repair Tools Adhesive
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    Ratings & Reviews
    3.5
    ★
    23 Ratings &
    1 Reviews
    • 5★
    • 4★
    • 3★
    • 2★
    • 1★
    • 10
    • 1
    • 5
    • 4
    • 3
    5

    Great product

    Good
    READ MORE

    Hemrajbhai Vasava

    Certified Buyer, Rajpipla

    1 month ago

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    Questions and Answers
    Q:Is it suitable for PCB repairs?
    A:Yes
    AKinfoTools
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    Q:Does it reduce oxidation?
    A:Yes, it prevents oxidation during soldering.
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    Q:Is it lead-free?
    A:Yes, compatible with lead-free solder.
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    Q:What temperature does it work best at?
    A:183-265 degree
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    Q:Can it be used for SMD components?
    A:Yes, ideal for SMD rework.
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    Q:Does it improve solder joint quality?
    A:Yes
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    Q:Is it no-clean flux?
    A:Yes
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    Q:What is its primary use?
    A:The MECHANIC XG-30 Solder Flux Paste is primarily used to enhance solder flow, prevent oxidation, and improve bonding during soldering, especially for electronics repair and circuit board assembly.
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    Q:What is MECHANIC XG-30?
    A:Solder flux paste
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