10CC RL-403 High quality Solder Paste Flux, RELIFE RL-403 Soldering Paste Tin Sn63/Pb67 20-38um For Phone motherboard BGA soldering repair. Lead solder paste, 183 ?, the degree of melting point, easy welding, easy molding 1.Good adhesion. Paste delicate, particles small, only 20~38 microns. 2.Excellent wettability.After opening, the surface remains moist for 36 hours. Does not affect the welding. 3.Lead solder paste, 183 ?, the degree of melting point, easy welding, easy molding