MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
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Specifications
Dimensions
Height
260 mm
Length
195 mm
Weight
369 gr
Series & Set Details
Series Name
Frontiers in Electronic Testing
Book Details
Title
Multi-Chip Module Test Strategies
Imprint
Springer-Verlag New York Inc.
Product Form
Paperback
Publisher
Springer-Verlag New York Inc.
Genre
Technology & Engineering
ISBN13
9781461377986
Book Category
Higher Education and Professional Books
BISAC Subject Heading
TEC008010
Book Subcategory
Applied Sciences and Other Technologies Books
ISBN10
9781461377986
Language
English
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