OSFT 30G Thermal Grease Paste Heat Sink Compound for CPU & Chipsets, Thermal Compound for Reducing Temperature Carbon Based Thermal Paste (30 g 5 W/mK)

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Description

1. High stability and reliability. 2. Apply to cpu ,VGA,LED,Chipset and other pc components. 3. Low thermal resistance, high conductivity for heat transfer. 4. Compliance with RoHS REACH PFOS requires. 5. Thermal Conductivity:>1.90W/m-K 6. Thermal Resistance: <0.225 degreeC-in^square/W.

Specifications

In The Box

General

Brand	OSFT
Model Number	30G Thermal Grease Paste Heat Sink Compound for CPU & Chipsets, Thermal Compound for Reducing Temperature (10 Pieces)
Model Name	30G Thermal Grease Paste Heat Sink Compound for CPU & Chipsets, Thermal Compound for Reducing Temperature
Type	Carbon Based
Quantity	30 g
Viscosity	200 Pa-s
Thermal Conductivity	5 W/mK
Composition	Aluminium oxide, zinc oxide
Net Quantity	30 g

Questions and Answers

Q:Can we use it in laptop cpu

A:yes

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