AKT AMAOE QU-2 STENCIL For QUALCOMM CPU MSM8953 B01, MSM8953 1AB, MSM8937, MSM8916, MSM8998 B, MSM8998 A Bga Reballing Stencil For Xiaomi Huawei Oppo Vivo Mtk Qualcomm Sm8350 Sdm888 Cpu Stencil (Pack of 1, SQUARE)

AKT AMAOE QU-2 STENCIL For QUALCOMM CPU MSM8953 B01, MSM8953 1AB, MSM8937, MSM8916, MSM8998 B, MSM8998 A Bga Reballing Stencil For Xiaomi Huawei Oppo Vivo Mtk Qualcomm Sm8350 Sdm888 Cpu Stencil (Pack of 1, SQUARE)

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Highlights

For Bga Reballing Stencil For Xiaomi Huawei Oppo Vivo Mtk Qualcomm Sm8350 Sdm888 Cpu
SQUARE Pattern
STAINLESS STEEL Material
W x H: 8 x 10 cm
Color: Grey

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AKinfoTools

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Description

MSM8994 IC STENCIL, MSM8974 IC STENCIL, MSM8994 IC STENCIL, MSM8992 IC STENCIL, Snapdragon 810 IC STENCIL, Snapdragon 801 IC STENCIL, Snapdragon 800 IC STENCIL, Snapdragon 840 IC STENCIL, MSM8953 B01 IC STENCIL, MSM8953 1AB IC STENCIL, MSM8937 IC STENCIL, MSM8916 IC STENCIL, MSM8998 B IC STENCIL, MSM8998 A IC STENCIL

Specifications

In The Box

Sales Package	1
Number of Contents in Sales Package	Pack of 1

General

Brand	AKT
Model Number	MSM8953 B01, MSM8953 1AB, MSM8937, MSM8916, MSM8998 B, MSM8998 A
Type	Bga Reballing Stencil For Xiaomi Huawei Oppo Vivo Mtk Qualcomm Sm8350 Sdm888 Cpu
Color	Grey
Pattern	SQUARE
Material	STAINLESS STEEL
Suitable For	It’s used for reballing and soldering SMDs and BGA components, especially in mobile and electronics repair.
Re-usable	Yes
Net Quantity	1
Model Name	AMAOE QU-2 STENCIL For QUALCOMM CPU